Scenario of Precision Electrostatic Extrusion for Aluminum Profiles
H-BN powder is formulated into a water-based coating, which is sprayed on the end face of extrusion billets, dummy blocks and mold surfaces. Replacing traditional carbon-based lubricants, it completely eliminates inclusions, bubbles and carbon contamination on aluminum profile surfaces, boosts the yield rate by over 15%, and extends the service life of dummy blocks by more than 30%. It is a mature mass-production solution in the current aluminum processing industry.
Mass Production Scenario of Thermal Interface Pads for Consumer Electronics
High-purity h-BN powder is used as an insulating and thermally conductive filler, filled into a silicone matrix to prepare thermal pads. Applied to the heat dissipation layer of SoC chips in flagship smartphones, it achieves efficient thermal conduction under full electrical insulation, reducing the core temperature of the chip under full load by 4~6℃, and has been adopted by many mainstream models.
Protection Scenario for Aero-Engine Components
H-BN powder is composited into a ceramic matrix to prepare high-temperature protective coatings, which are applied on turbine blades and nozzles of aero-engines. It can operate stably for a long time under the scouring of high-speed airflow above 1200℃. Meanwhile, as an additive in aviation lubricants, it greatly improves the high-temperature anti-wear performance of bearings and gears.
Demolding Scenario for Special Glass Forming
The high-temperature resistant coating made from h-BN powder is sprayed on the surface of glass forming molds. Leveraging its complete non-stick property with molten glass, it reduces the surface scratch defect rate of products to nearly zero when manufacturing high-precision optical lens glass, and significantly cuts down the working hours for mold polishing and maintenance.
Mass Production Scenario of Semiconductor Packaging
In the packaging process of integrated circuits, insulating components sintered from h-BN powder are used as supports for the metallization evaporation process of wafers. They fully resist the erosion of high-temperature molten metal and avoid the risk of circuit short circuits, making them mature supporting consumables for domestic wafer fabs.
